Toshiba develops 2 new process technologies for MC 2015-07-27

Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog power process. The new process technologies were developed for low-cost applications such as microcontrollers (MCU), wireless communication ICs, motor controller drivers and power supply ICs.

The IoT market is seeing strong demand for low power consumption in areas including wearable and healthcare-related equipment. In response, Toshiba has adopted SST's third-generation SuperFlash cell technology, in combination with its own 65nm logic process technology. Toshiba has also fine-tuned circuits and manufacturing processes in developing its ultra-low power consumption flash embedded logic process. Microcontrollers for consumer and industrial applications that apply the process can lower power consumption to approximately 60% that of current mainstream technology, according to the company.

Following the first series of MCUs, Toshiba plans to release sample BLE (Bluetooth Low Energy) products, the short-range wireless technology, in fiscal year 2016. The company also plans to apply the 65nm process to its wireless communication IC product family that can optimize use of low power consumption characteristics, including NFC controllers and contactless cards.

In applications where significant cost reductions are a concern, Toshiba has developed an NVM embedded process that adopts Taiwan-based Yield Microelectronics' (YMC) single-poly MTP (Multi-time programmable) cells on Toshiba's 130nm logic process technology. Applying MTP specifications for write times improves the process' performance while limiting increased steps in mask pattern lithography to three or fewer, and even none.

In addition, by using MTP to adjust output accuracy, Toshiba will expand its product line-up in fields where higher accuracy is essential, such as power management ICs, the company said.

Sample shipments of the 130nm-NVM and 65nm-flash are scheduled for the fourth quarter of 2015 and the second quarter of 2016, respectively.